Semiconductor Integration Technologies
- Integrated packaging
- Multichip modules
- Artificial structuring methods
- Chemical vapor & sputter deposition
- Molecular and chemical beam
- Spin-on disposition
- Vacuum evaporation
Semiconductor integration technologies are technologies for combining multiple integrated circuits into efficient modules for performance of complex tasks.
Integration technologies are essential for creating economically competitive multi-component systems. They also involve improvements in materials technologies because they involve advanced ceramics and other materials. Semiconductor integration technologies also contribute to harnessing information technology by reducing costs of components for computing systems and by creating multi-chip modules which allow faster movement of electrons between ICs.
Semiconductor integration technologies contribute to national security and warfighting capabilities. By creating smaller and faster equipment with multi-chip systems, semiconductor integration technologies contribute to a capability for real-time knowledge of the enemy and its near-real-term distribution to the fighting forces.
Japan and the United States are roughly comparable across the entire range of semiconductor manufacturing equipment; Europe lags slightly. In one of the single most important areas-- optical lithography--firms in Japan, Europe, and the United States all have generally comparable technology, even though Japanese firms have a substantial lead in market share. Companies from each region have leading-edge capability in state-of-the-art, i-line wafer steppers; all are developing successor wafer stepper systems using excimer lasers--rather than mercury arc lamps--to generate deep ultraviolet light for shorter wavelengths.